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Matching
Fluid Dispensers To Materials for Electronics Applications Understanding the technology behind popular non - contact dispensers for electronics assembly. Paper prepared by Creative Automation Co. for publication in Electronic Packaging & Production. There are four basic dispensing technologies being used today in Electronics Assembly. Although all the technologies can theoretically dispense almost all materials in most configurations (fills, beads, dots), each excels when used with certain materials (Fig. 1) and when used in specific applications (Fig. 2). This article will try to match the basic dispensing technologies to the types of material they are best suited to dispense. Fig 1. Material Viscosity Compatibility |
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